PCB設(shè)計(jì)規(guī)則中英文對(duì)照一覽
發(fā)布時(shí)間:2020-02-13 責(zé)任編輯:xueqi
【導(dǎo)讀】今天分享一些PCB設(shè)計(jì)規(guī)則的中英文對(duì)照,來看看你都知道哪些吧!
PCB設(shè)計(jì)規(guī)則中英文對(duì)照
Electrical(電氣規(guī)則):
Clearance:安全間距規(guī)則
Short Circuit:短路規(guī)則
UnRouted Net:未布線網(wǎng)絡(luò)規(guī)則
UnConnected Pin:未連線引腳規(guī)則
Routing(布線規(guī)則):
Width:走線寬度規(guī)則
Routing Topology:走線拓?fù)洳季忠?guī)則
Routing Priority:布線優(yōu)先級(jí)規(guī)則
Routing Layers:布線板層線規(guī)則
Routing Corners:導(dǎo)線轉(zhuǎn)角規(guī)則
Routing Via Style:布線過孔形式規(guī)則
Fan out Control:布線扇出控制規(guī)則
Differential Pairs Routing:差分對(duì)布線規(guī)則
SMT(表貼焊盤規(guī)則):
SMD To Corner:SMD焊盤與導(dǎo)線拐角處最小間距規(guī)則
SMD To Plane:SMD焊盤與電源層過孔最小間距規(guī)則
SMD Neck Down:SMD焊盤頸縮率規(guī)則
Mask(阻焊層規(guī)則):
Solder Mask Expansion:阻焊層收縮量規(guī)則
Paste Mask Expansion:助焊層收縮量規(guī)則
Plane(電源層規(guī)則):
Power Plane Connect Style:電源層連接類型規(guī)則
Power Plane Clearance:電源層安全間距規(guī)則
Polygon Connect Style:焊盤與覆銅連接類型規(guī)則
TestPoint(測試點(diǎn)規(guī)則):
Testpoint Style:測試點(diǎn)樣式規(guī)則
TestPoint Usage:測試點(diǎn)使用規(guī)則
Manufacturing(工業(yè)規(guī)則):
MinimumAnnularRing: 焊盤銅環(huán)最小寬度規(guī)則,防止焊盤脫落。
Acute Angle:銳角限制規(guī)則
Hole Size:孔徑限制規(guī)則
Layer Pairs:配對(duì)層設(shè)置規(guī)則,設(shè)定所有鉆孔電氣符號(hào)(焊盤和過孔)的起始層和終止層。
Hole To Hole Clearance:孔間間距桂鄂
Minimum SolderMask Sliver:最小阻焊間隙違反規(guī)則
Silkscreen Over Component Pads:絲印與元器件焊盤間距規(guī)則
Silk To Silk Clearance:絲印間距規(guī)則
Net Antennae:網(wǎng)絡(luò)天線規(guī)則
High Speed(高頻電路規(guī)則):
ParallelSegment:平行銅膜線段間距限制規(guī)則
Length:網(wǎng)絡(luò)長度限制規(guī)則
Matched Net Lengths:網(wǎng)絡(luò)長度匹配規(guī)則
Daisy Chain Stub Length:菊花狀布線分支長度限制規(guī)則
Vias Under SMD:SMD焊盤下過孔限制規(guī)則
Maximum Via Count:最大過孔數(shù)目限制規(guī)則
Placement(元件布置規(guī)則):
Room Definition:元件集合定義規(guī)則
Component Clearance:元件間距限制規(guī)則
Component Orientations:元件布置方向規(guī)則
Permitted Layers:允許元件布置板層規(guī)則
Nets To Ignore:網(wǎng)絡(luò)忽略規(guī)則
Hight:高度規(guī)則
Signal Integrity(信號(hào)完整性規(guī)則):
Signal Stimulus:激勵(lì)信號(hào)規(guī)則
Undershoot-Falling Edge:負(fù)下沖超調(diào)量限制規(guī)則
Undershoot-Rising Edge:正下沖超調(diào)量限制規(guī)則
Impedance:阻抗限制規(guī)則
Signal Top Value:高電平信號(hào)規(guī)則
Signal Base Value:低電平信號(hào)規(guī)則
Flight Time-Rising Edge:上升飛行時(shí)間規(guī)則
Flight Time-Falling Edge:下降飛行時(shí)間規(guī)則
Slope-Rising Edge:上升沿時(shí)間規(guī)則
Slope-Falling Edge:下降沿時(shí)間規(guī)則
Supply Nets:電源網(wǎng)絡(luò)規(guī)則
特別推薦
- 機(jī)構(gòu)預(yù)警:DRAM價(jià)格壓力恐持續(xù)至2027年,存儲(chǔ)原廠加速擴(kuò)產(chǎn)供應(yīng)HBM
- IDC發(fā)出預(yù)警:存儲(chǔ)芯片暴漲,明年DIY電腦成本恐大幅攀升
- 2025年全球智能手表市場觸底反彈,出貨量將增長7%
- 從集成到獨(dú)立!三星首款2nm芯片Exynos 2600將不集成5G基帶
- AI熱潮的連鎖反應(yīng):三星、SK海力士上調(diào)HBM3E合約價(jià)
技術(shù)文章更多>>
- 2026 年,智能汽車正式進(jìn)入“端云協(xié)同”的分水嶺
- 智能座艙新戰(zhàn)事:大模型不是答案,只是起點(diǎn)
- 千問APP與通義系列大模型,才是智能汽車的“黃金組合”
- 揭秘對(duì)稱認(rèn)證技術(shù)是如何扼住假冒零部件的咽喉?
- 面對(duì)高復(fù)雜度芯片,何時(shí)轉(zhuǎn)向多裸片封裝破局?
技術(shù)白皮書下載更多>>
- 車規(guī)與基于V2X的車輛協(xié)同主動(dòng)避撞技術(shù)展望
- 數(shù)字隔離助力新能源汽車安全隔離的新挑戰(zhàn)
- 汽車模塊拋負(fù)載的解決方案
- 車用連接器的安全創(chuàng)新應(yīng)用
- Melexis Actuators Business Unit
- Position / Current Sensors - Triaxis Hall
熱門搜索




